Abstract

The flexible packaging industry is experiencing significant growth, driven by consumer demand for lightweight, convenient, and resource-efficient products. This expansion needs a parallel increase in the supply of high-performance inks and materials, particularly for multilayer laminated structures. The lamination of these structures is a complex process often compromised by issues related to adhesion, optical defects, and the long-term integrity of barrier properties. These laminates are primarily based on substrates such as Bioriented Polypropylene (BOPP) and Polyethylene Terephthalate (PET). A key technological advancement in this sector is Electron Beam (EB) curing, which offers a sustainable and efficient method for flexible packaging processing.

However, the integrity and performance of these multilayer laminates critically depend on the lamination bond strength. Despite its crucial importance, the industrial evaluation of adhesion is often limited to simple lamination force measurements and qualitative tape-peel tests. These methods are insufficient for a comprehensive characterization of the delamination process and for accurately predicting the effects of material properties or processing conditions.

This research aims to develop a robust methodology for understanding the fundamental phenomena governing the delamination of flexible polymeric materials, specifically those laminated with EB-cured offset inks. The study seeks to move beyond simple force measurements and establish a scientific framework that allows for the quantitative interpretation and prediction of delamination behavior.